{"version":"0.1","company":{"name":"YubHub","url":"https://yubhub.co","jobsUrl":"https://yubhub.co/jobs/skill/windows-and-linux-operating-systems"},"x-facet":{"type":"skill","slug":"windows-and-linux-operating-systems","display":"Windows And Linux Operating Systems","count":1},"x-feed-size-limit":100,"x-feed-sort":"enriched_at desc","x-feed-notice":"This feed contains at most 100 jobs (the most recently enriched). For the full corpus, use the paginated /stats/by-facet endpoint or /search.","x-generator":"yubhub-xml-generator","x-rights":"Free to redistribute with attribution: \"Data by YubHub (https://yubhub.co)\"","x-schema":"Each entry in `jobs` follows https://schema.org/JobPosting. YubHub-native raw fields carry `x-` prefix.","jobs":[{"@context":"https://schema.org","@type":"JobPosting","identifier":{"@type":"PropertyValue","name":"YubHub","value":"job_aa155194-bee"},"title":"Advanced Packaging Design, Sr Staff Engineer","description":"<p>Our Hardware Engineers at Synopsys are responsible for designing and developing cutting-edge semiconductor solutions.</p>\n<p>They work on intricate tasks such as chip architecture, circuit design, and verification to ensure the efficiency and reliability of semiconductor products.</p>\n<p>These engineers play a crucial role in advancing technology and enabling innovations in various industries.</p>\n<p><strong>Job Description</strong></p>\n<p>At Synopsys, we drive the innovations that shape the way we live and connect.</p>\n<p>Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines.</p>\n<p>We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content.</p>\n<p>Join us to transform the future through continuous technological innovation.</p>\n<p><strong>Responsibilities</strong></p>\n<ul>\n<li>Collaborating with cross-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.</li>\n<li>Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.</li>\n<li>Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.</li>\n<li>Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.</li>\n<li>Resolving a wide range of design and integration issues using creative, data-driven approaches.</li>\n<li>Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.</li>\n<li>Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.</li>\n</ul>\n<p><strong>Requirements</strong></p>\n<ul>\n<li>Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).</li>\n<li>Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.</li>\n<li>Expert knowledge of advanced circuit and transmission line theory.</li>\n<li>Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.</li>\n<li>Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).</li>\n<li>Familiarity with both Windows and Linux operating systems.</li>\n<li>Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.</li>\n</ul>\n<p><strong>What You’ll Need</strong></p>\n<ul>\n<li>A creative problem solver with strong analytical and critical thinking skills.</li>\n<li>An excellent communicator, able to explain technical concepts to diverse audiences.</li>\n<li>A collaborative team player who values inclusivity, diversity, and shared success.</li>\n<li>Adaptable, quick to learn, and enthusiastic about adopting new technologies and methodologies.</li>\n<li>Detail-oriented, quality-driven, and committed to continuous improvement and innovation.</li>\n<li>Self-motivated with a strong sense of ownership and accountability.</li>\n</ul>\n<p><strong>The Team You’ll Be A Part Of</strong></p>\n<p>Join a global, highly skilled, and supportive team dedicated to advancing the forefront of package design and integration.</p>\n<p>Our team works closely with R&amp;D, product management, and customer engineering groups to foster innovation, technical excellence, and open communication.</p>\n<p>Together, we tackle some of the most complex challenges in the semiconductor industry, supporting each other’s growth and celebrating our collective achievements.</p>\n<p><strong>Rewards and Benefits</strong></p>\n<p>We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs.</p>\n<p>Our total rewards include both monetary and non-monetary offerings.</p>\n<p>Your recruiter will provide more details about the salary range and benefits during the hiring process.</p>\n<p style=\"margin-top:24px;font-size:13px;color:#666;\">XML job scraping automation by <a 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