{"version":"0.1","company":{"name":"YubHub","url":"https://yubhub.co","jobsUrl":"https://yubhub.co/jobs/skill/rf-and-digital-electronics"},"x-facet":{"type":"skill","slug":"rf-and-digital-electronics","display":"Rf And Digital Electronics","count":1},"x-feed-size-limit":100,"x-feed-sort":"enriched_at desc","x-feed-notice":"This feed contains at most 100 jobs (the most recently enriched). For the full corpus, use the paginated /stats/by-facet endpoint or /search.","x-generator":"yubhub-xml-generator","x-rights":"Free to redistribute with attribution: \"Data by YubHub (https://yubhub.co)\"","x-schema":"Each entry in `jobs` follows https://schema.org/JobPosting. YubHub-native raw fields carry `x-` prefix.","jobs":[{"@context":"https://schema.org","@type":"JobPosting","identifier":{"@type":"PropertyValue","name":"YubHub","value":"job_9f9c3175-1df"},"title":"Senior Mechanical Engineer - RF Packaging","description":"<p>As a Senior Mechanical Engineer for Electronics Packaging at Astranis, you will own the complete lifecycle of various components and subsystems on our spacecraft. This includes developing requirements for subsystems and components, performing mechanical design and analysis of complex electronics enclosures, and managing system level schedule and integration requirements.</p>\n<p>You will work together with various other teams at Astranis to make these a reality. In addition to being a significant individual on your own, you will mentor and train junior mechanical engineers on such projects.</p>\n<p>Key responsibilities include:</p>\n<ul>\n<li>Complete ownership of product outcomes for spaceflight hardware, with a focus on high frequency active and passive RF and digital electronics</li>\n<li>Develop requirements for subsystems and components including loads, interfaces, and functional requirements</li>\n<li>Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements</li>\n<li>Develop and define design best practices for future programs</li>\n<li>Manage system level schedule and integration requirements for your components while working together with the Assembly, Integration, and Test team to enable a smooth build process</li>\n</ul>\n<p>Requirements include:</p>\n<ul>\n<li>B.S. or M.S in mechanical, electrical, aerospace engineering, or equivalent</li>\n<li>4 - 15+ years of mechanical design or equivalent experience</li>\n<li>3+ years designing, analyzing, and testing active or passive high frequency RF electronics packages</li>\n<li>Familiarity with chip and wire and splitblock construction</li>\n<li>Strong CAD design and Finite Element analysis skills</li>\n<li>Experience with GD&amp;T and designing for manufacturability</li>\n<li>Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30-40 components in aerospace or similar</li>\n<li>A passion for hardware development, including working in a fast-paced environment with hands-on design and development</li>\n<li>A motivated leader who has experience mentoring and supporting junior engineers</li>\n</ul>\n<p>Bonus requirements include:</p>\n<ul>\n<li>Experience with Ku, Ka, and Q/V band electronics package development for space missions</li>\n<li>Experience with thermal analysis and thermal management techniques for RF electronics in space applications, including with heat pipes</li>\n<li>Experience with vibration environments and mechanical testing on spacecraft components</li>\n<li>Experience with brazed construction techniques for RF packages</li>\n<li>Experience in synthesizing requirements and flowing them down to sub-scale verification builds and testing</li>\n</ul>\n<p>What we offer:</p>\n<ul>\n<li>All our positions offer a compensation package that includes equity and robust benefits</li>\n<li>Base pay is just one component of Astranis&#39;s total rewards package</li>\n<li>Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals</li>\n<li>Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources</li>\n<li>The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials &amp; certifications, educational attainment, skill level requirements, and the level and scope of the position</li>\n</ul>\n<p>Base Salary: $145,000-$195,000 USD</p>\n<p>U.S. Citizenship, Lawful Permanent Residency, or Refugee/Asylee Status Required (To comply with U.S. Government space technology export regulations, applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3))</p>\n<p style=\"margin-top:24px;font-size:13px;color:#666;\">XML job scraping automation by <a href=\"https://yubhub.co\">YubHub</a></p>","url":"https://yubhub.co/jobs/job_9f9c3175-1df","directApply":true,"hiringOrganization":{"@type":"Organization","name":"Astranis","sameAs":"https://astranis.com/","logo":"https://logos.yubhub.co/astranis.com.png"},"x-apply-url":"https://job-boards.greenhouse.io/astranis/jobs/4639054006","x-work-arrangement":"onsite","x-experience-level":"senior","x-job-type":"full-time","x-salary-range":"$145,000-$195,000 USD","x-skills-required":["Mechanical Engineering","Electronics Packaging","RF and Digital Electronics","CAD Design","Finite Element Analysis","GD&T","Design for Manufacturability"],"x-skills-preferred":["Ku, Ka, and Q/V band electronics package development","Thermal analysis and thermal management techniques","Vibration environments and mechanical testing","Brazed construction techniques","Synthesizing requirements and flowing them down to sub-scale verification builds and testing"],"datePosted":"2026-04-24T15:20:02.447Z","jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"San Francisco"}},"employmentType":"FULL_TIME","occupationalCategory":"Engineering","industry":"Technology","skills":"Mechanical Engineering, Electronics Packaging, RF and Digital Electronics, CAD Design, Finite Element Analysis, GD&T, Design for Manufacturability, Ku, Ka, and Q/V band electronics package development, Thermal analysis and thermal management techniques, Vibration environments and mechanical testing, Brazed construction techniques, Synthesizing requirements and flowing them down to sub-scale verification builds and testing","baseSalary":{"@type":"MonetaryAmount","currency":"USD","value":{"@type":"QuantitativeValue","minValue":145000,"maxValue":195000,"unitText":"YEAR"}}}]}