Senior Failure Analysis Engineer (Reliability Test Team) · Astranis

Fri, 24 Apr 2026 15:20:34 GMT
Engineering

Astranis · San Francisco · Base Salary: $145,000-$190,000 USD · onsite

As a Senior Failure Analysis (FA) Engineer, you will be embedded within our verification and validation development cycle, performing hands-on investigation of hardware failures coming directly out of test environments, qualification experiments, and design verification activities.

You will work at the front of the product lifecycle; providing rapid, actionable root-cause findings that feed directly back into active design iterations. You will be the primary technical owner of understanding why prototype hardware fails, translating physical evidence into design, process, and supplier improvements that accelerate our path to reliable production hardware.

Key responsibilities include:

Performing failure analysis investigations on Printed Circuit Board Assemblies (PCBAs), components, modules, and subsystems returned from environmental, electrical, and mechanical cycling test campaigns Troubleshooting and isolating failures using drawings, schematics, circuit tracing, fault isolation techniques, and Design of Experiments (DOE) where appropriate Applying analytical techniques including optical and digital microscopy, X-ray/Computed Tomography (CT), mechanical cross-sectioning, curve tracing, and thermal imaging to identify failure mechanisms at the sub-system, board, and component level Coordinating with external analytical laboratories for advanced techniques such as Scanning Electron Microscopy / Energy Dispersive Spectroscopy (SEM/EDS), Fourier-Transform Infrared Spectroscopy (FTIR), and Focused Ion Beam (FIB) analysis when deeper characterization is required Authoring concise technical FA reports with documented findings, images, and conclusions that support design review discussions Translating physical failure evidence into clear, actionable root-cause conclusions and corrective action recommendations Collaborating with design, reliability, quality, manufacturing, and test engineering teams to drive corrective actions and prevent recurrence across prototype iterations Supporting Failure Modes and Effects Analysis, Design Verification, Validation, and Qualification planning and with proactive FA insights and risk identification based on lessons learned from previous builds Identifying and flagging failure patterns related to PCB/PCBA assembly, Surface Mount Technology (SMT) soldering processes, and supplier quality issues to inform Design for Quality and Reliability Building and maintaining a failure database to capture institutional knowledge and enable trend analysis across prototype builds Establishing and continuously improving FA processes, workflows, and documentation standards appropriate for a fast-moving prototype environment

Requirements include:

Bachelor's degree in Electrical Engineering, Materials Science, Electronic Engineering Technology, Mechanical Engineering or a related field 5+ years of hands-on failure analysis experience on electronic hardware (PCBAs, motors, batteries, components, interconnects) Background in a prototype or New Product Introduction (NPI) environment with rapid iteration cycles Proficiency with standard FA tools: optical/digital microscopes, multimeters, oscilloscopes, and curve tracers Experience with thermal imaging and thermal characterization of electronic assemblies Experience with non-destructive and destructive analysis methods including X-ray/CT and mechanical cross-sectioning Demonstrated ability to read and interpret PCB schematics and layouts Experience coordinating with external analytical labs or vendors for advanced characterization Strong technical writing skills with the ability to produce clear, evidence-based FA reports

Bonus qualifications include:

Master's degree in Electrical Engineering, Materials Science, or a related field Experience with structured problem-solving methodologies such as 8D, Fishbone, or 5-Why analysis Familiarity with physics-of-failure approaches to root-cause analysis Familiarity with PCB/PCBA assembly and SMT processes, including the ability to identify assembly and soldering-related defects

What we offer:

All our positions offer a compensation package that includes equity and robust benefits. Base pay is just one component of Astranis's total rewards package. Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals.

Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources. The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position.

Base Salary: $145,000-$190,000 USD