As a Senior Failure Analysis (FA) Engineer, you will be embedded within our verification and validation development cycle, performing hands-on investigation of hardware failures coming directly out of test environments, qualification experiments, and design verification activities.
\nYou will work at the front of the product lifecycle; providing rapid, actionable root-cause findings that feed directly back into active design iterations. You will be the primary technical owner of understanding why prototype hardware fails, translating physical evidence into design, process, and supplier improvements that accelerate our path to reliable production hardware.
\nKey responsibilities include:
\nPerforming failure analysis investigations on Printed Circuit Board Assemblies (PCBAs), components, modules, and subsystems returned from environmental, electrical, and mechanical cycling test campaigns Troubleshooting and isolating failures using drawings, schematics, circuit tracing, fault isolation techniques, and Design of Experiments (DOE) where appropriate Applying analytical techniques including optical and digital microscopy, X-ray/Computed Tomography (CT), mechanical cross-sectioning, curve tracing, and thermal imaging to identify failure mechanisms at the sub-system, board, and component level Coordinating with external analytical laboratories for advanced techniques such as Scanning Electron Microscopy / Energy Dispersive Spectroscopy (SEM/EDS), Fourier-Transform Infrared Spectroscopy (FTIR), and Focused Ion Beam (FIB) analysis when deeper characterization is required Authoring concise technical FA reports with documented findings, images, and conclusions that support design review discussions Translating physical failure evidence into clear, actionable root-cause conclusions and corrective action recommendations Collaborating with design, reliability, quality, manufacturing, and test engineering teams to drive corrective actions and prevent recurrence across prototype iterations Supporting Failure Modes and Effects Analysis, Design Verification, Validation, and Qualification planning and with proactive FA insights and risk identification based on lessons learned from previous builds Identifying and flagging failure patterns related to PCB/PCBA assembly, Surface Mount Technology (SMT) soldering processes, and supplier quality issues to inform Design for Quality and Reliability Building and maintaining a failure database to capture institutional knowledge and enable trend analysis across prototype builds Establishing and continuously improving FA processes, workflows, and documentation standards appropriate for a fast-moving prototype environment
\nRequirements include:
\nBachelor's degree in Electrical Engineering, Materials Science, Electronic Engineering Technology, Mechanical Engineering or a related field 5+ years of hands-on failure analysis experience on electronic hardware (PCBAs, motors, batteries, components, interconnects) Background in a prototype or New Product Introduction (NPI) environment with rapid iteration cycles Proficiency with standard FA tools: optical/digital microscopes, multimeters, oscilloscopes, and curve tracers Experience with thermal imaging and thermal characterization of electronic assemblies Experience with non-destructive and destructive analysis methods including X-ray/CT and mechanical cross-sectioning Demonstrated ability to read and interpret PCB schematics and layouts Experience coordinating with external analytical labs or vendors for advanced characterization Strong technical writing skills with the ability to produce clear, evidence-based FA reports
\nBonus qualifications include:
\nMaster's degree in Electrical Engineering, Materials Science, or a related field Experience with structured problem-solving methodologies such as 8D, Fishbone, or 5-Why analysis Familiarity with physics-of-failure approaches to root-cause analysis Familiarity with PCB/PCBA assembly and SMT processes, including the ability to identify assembly and soldering-related defects
\nWhat we offer:
\nAll our positions offer a compensation package that includes equity and robust benefits. Base pay is just one component of Astranis's total rewards package. Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals.
\nAstranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources. The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position.
\nBase Salary: $145,000-$190,000 USD
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\nThis is a full-time, onsite position with a competitive salary range of $115,527 - $173,291 per year, plus bonus, benefits, and equity. The ideal candidate will have a Bachelor's degree in electrical engineering, a minimum of 3+ years of experience as an Electrical Engineer, and strong technical fundamentals.
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\nIn this role, you will contribute to environmental and stress testing efforts, support failure analysis investigations, and help analyze test and field data to identify potential reliability risks. You’ll participate in design reviews and FMEA activities, assist in root cause investigations for manufacturing and field issues, and support initiatives to improve hardware reliability across the program.
\nKey responsibilities include:
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\nResponsibilities:
\nProvide DFM/DFT feedback to design engineering to mitigate manufacturing and electrical test escapes.
\nOversee New Product Introduction (NPI) with Electrical Design, Manufacturing Engineering, Hardware Test, and Supplier Development teams to ensure smooth production integration and robust testing coverage.
\nLead initial root cause analysis (RCA) for PCBA and electrical issues detected in production,driving containment, fault isolation, and data-backed corrective actions.
\nCollaborate with Production, Hardware Test, Electrical Engineering, and Supplier Development Engineering to identify systemic issues and improve product and supplier performance.
\nMaintain RCA documentation and non-conformance records in the Quality Management System (QMS), ensuring compliance with AS9100 and ISO9001 standards.
\nOwn end-to-end quality for avionics electronics and harnesses,from assembly through aircraft acceptance test.
\nDefine inspection steps, acceptance criteria, and manufacturing quality controls for PCB/PCBA electrical assemblies and harnesses.
\nReport recurring issues and lessons learned during design reviews to prevent repeat failures.
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