Senior Mechanical Engineer - RF Packaging · Astranis

Fri, 24 Apr 2026 15:20:02 GMT
Engineering

Astranis · San Francisco · $145,000-$195,000 USD · onsite

As a Senior Mechanical Engineer for Electronics Packaging at Astranis, you will own the complete lifecycle of various components and subsystems on our spacecraft. This includes developing requirements for subsystems and components, performing mechanical design and analysis of complex electronics enclosures, and managing system level schedule and integration requirements.

You will work together with various other teams at Astranis to make these a reality. In addition to being a significant individual on your own, you will mentor and train junior mechanical engineers on such projects.

Key responsibilities include:

Complete ownership of product outcomes for spaceflight hardware, with a focus on high frequency active and passive RF and digital electronics

Develop requirements for subsystems and components including loads, interfaces, and functional requirements

Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements

Develop and define design best practices for future programs

Manage system level schedule and integration requirements for your components while working together with the Assembly, Integration, and Test team to enable a smooth build process

Requirements include:

B.S. or M.S in mechanical, electrical, aerospace engineering, or equivalent

4 - 15+ years of mechanical design or equivalent experience

3+ years designing, analyzing, and testing active or passive high frequency RF electronics packages

Familiarity with chip and wire and splitblock construction

Strong CAD design and Finite Element analysis skills

Experience with GD&T and designing for manufacturability

Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30-40 components in aerospace or similar

A passion for hardware development, including working in a fast-paced environment with hands-on design and development

A motivated leader who has experience mentoring and supporting junior engineers

Bonus requirements include:

Experience with Ku, Ka, and Q/V band electronics package development for space missions

Experience with thermal analysis and thermal management techniques for RF electronics in space applications, including with heat pipes

Experience with vibration environments and mechanical testing on spacecraft components

Experience with brazed construction techniques for RF packages

Experience in synthesizing requirements and flowing them down to sub-scale verification builds and testing

What we offer:

All our positions offer a compensation package that includes equity and robust benefits

Base pay is just one component of Astranis's total rewards package

Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals

Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources

The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position

Base Salary: $145,000-$195,000 USD

U.S. Citizenship, Lawful Permanent Residency, or Refugee/Asylee Status Required (To comply with U.S. Government space technology export regulations, applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3))