As a Mechanical Engineer at NVIDIA Networking division, you will drive multiple early design concepts while working in fast-paced product development cycles. You will independently lead product design from concept, through detailed design, and support it during Qualification, NPI and MP stages. You will also join task forces to investigate and support production excursions, failure analysis and reliability issues.

To succeed in this role, you will need a B.Sc. in Mechanical Engineering and 2+ years of experience in electro-mechanical product design, including PCB/PCBA design. You will also need excellent knowledge & experience with 3D software for mechanical design (Inventor/Creo) and knowledge with some of the following various production technologies: PCB design, Sheet metal, Electronic Liquid cooling, Metal die casting, Machining (Milling), Extrusion, Plastic injection molding.

You will be responsible for producing of manufacturing documentation (Drawing, Specs) and will have computers & software: PDP (Advantage), Office. You will be self-motivated with a sharp learning curve and able to manage multiple tasks while being very well organized. You will also have multi-disciplinary abilities, strong communication skills, English & Hebrew, written and verbal, and team player skills.

If you have skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners, proficient in mechanical stress simulation tools, background in developing liquid cooled systems, familiar with IDF file exchange processes with Layout engineers, and expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies, then this could be the perfect opportunity for you.

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You will also be responsible for real-time problem-solving of unknown engineering issues in the production line, integration and matrix management as product's engine and center key for success, and establishing new production lines at CM's sites from engineering POV.

Key responsibilities include:

• Performing DFA for products and its related jigs
• Performing PFMEA for error-less implementation in a production line
• Developing and validating production process for each project type
• Real-time problem-solving of unknown engineering issues in the production line
• Integration and matrix management as product's engine and center key for success
• Establishing new production lines at CM's sites from engineering POV

Requirements include:

• B.Sc. in Mechanical, Industrial engineering or equivalent experience
• 5+ years of relevant experience
• Experience in leading projects at the electro-mechanical field, CMs/vendors management, and Project management, production management or quality leader at CM's site
• Excellent interpersonal and communication skills
• Preciseness, proactiveness, pragmatism and creativity as way of life
• Excellent level of English (reading and writing)
• Business travels abroad occasionally may be required

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This key position includes close interaction with HW, NPI, Thermal, Layout, Quality and Supply chain teams.

As a Senior Opto-Mechanical Failure Analysis Engineer, you will lead multidisciplinary investigations for advanced opto-mechanical and electro-mechanical products, including PCB/PCBA assemblies and complex system integrations.

Your responsibilities will include driving debug activities, performing hands-on root cause analysis on field returns, reliability failures, manufacturing defects, and system-level issues using analytical and laboratory techniques.

You will also work closely with Mechanical, Electrical, Signal Integrity, Thermal, Reliability, and Manufacturing Engineering teams to identify corrective and preventive actions.

In addition, you will perform and drive mechanical simulations of components and assemblies to support failure analysis, root cause investigations, and product design optimization.

Develop failure analysis methodologies, documentation standards, and best practices to improve product robustness and reliability.

Present technical findings and recommendations to cross-functional engineering and management teams.

Requirements:

• B.Sc. in Mechanical Engineering or higher, with 5+ years of experience in opto-mechanical and electro-mechanical product development, including PCB/PCBA design.

• Strong understanding of failure analysis methodologies, root cause investigation, reliability engineering principles, and physics-of-failure analysis.

• Hands-on experience debugging complex opto-electro-mechanical systems and identifying thermal, mechanical, assembly, manufacturing, and reliability-related failure mechanisms.

• Experience leading complex technical investigations, including DOE execution, 8D methodology, and preparation of detailed investigation and failure analysis reports.

• Strong background in mechanical simulations for components and assemblies as part of product design and failure analysis activities.

• Hands-on experience with laboratory and analytical tools such as microscopy, X-ray, CT scanning, thermal imaging, strain/stress measurements, and optical lab equipment in clean room environments.

• Knowledge of optical manufacturing processes, inspection methods, optical modules, fiber-optic interconnects, and multidisciplinary system integration.

• Excellent hands-on experience with 3D CAD tools; Creo is an advantage.

• Self-motivated team player with strong verbal and written communication skills in both English and Hebrew.

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This key position includes leading the product and fixtures design, close interaction with HW, PMC (Product management & configuration), NPI, Thermal, Layout, Quality and Supply chain groups.

NVIDIA Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors including high performance computing, enterprise, data centers, cloud computing and Web 2.0.

What you will be doing:

• Drive multiple early design concepts while working in fast-paced product development cycles.
• Independently lead product design from concept, through detailed design, and support it during Qualification, NPI and MP stages.
• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues.
• Collaborate in research of groundbreaking technologies, materials, and processes with other groups to bring in creative ideas that solve ever growing needs.

What we need to see:

• B.Sc. in Mechanical Engineering or higher degree.
• 8+ years of experience in electro-mechanical product design, including PCB/PCBA design.
• Self-motivated with a sharp learning curve and able to work independently and as a teammate.
• Excellent hands-on experience with 3D CAD.
• Strong background in design of components for high-volume manufacturing technologies, such as: stamping, die casting, extrusion, and injection.
• Experience in developing fixtures/jigs for product assembly/testing.
• High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and geometric tolerancing.
• Experience in defining and executing DOE (design of experiment)
• Strong verbal and written communication skills in both English and Hebrew.

Ways to stand out from the crowd:

• Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.
• Proficient in mechanical stress simulation tools.
• Background in developing liquid cooled systems.
• Familiar with IDF file exchange processes with Layout engineers.
• Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

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This position serves as a critical link between Mechanical Design and Product Lifecycle Management (PLM). You will be responsible for the integrity of our mechanical data, ensuring designs transition seamlessly from the CAD environment to the production floor through rigorous documentation, verification, and lifecycle management.

Responsibilities:

• Build, maintain, and release Mechanical BOMs in the Windchill PLM system, including part structures, revisions, and data accuracy throughout the product lifecycle.
• Coordinate and validate CAD data (Creo preferred), generate manufacturing files (STEP and neutral formats), and ensure compliance with internal modeling standards.
• Create and maintain mechanical drawings, assembly instructions, and engineering documentation with strong understanding of manufacturing processes and tolerances.
• Lead Engineering Change processes (ECR/ECO), ensuring changes are properly documented, reviewed, approved, and implemented with minimal impact on production and supply chain.
• Support Mechanical Verification Testing (MVT) activities in collaboration with design and lab teams to validate product performance, reliability, and assembly readiness.
• Manage prototype and production logistics, including Purchase Requests (PRs), material handling, and hardware availability for builds and testing activities.
• Support product transfer to manufacturing, act as the main contact for BOM-related production issues, and provide ongoing support throughout the production process.

Requirements:

• Practical Engineer or B.Sc. in Mechanical Engineering degree.
• 2+ years of experience in similar roles (e.g., Mechanical Coordinator, PLM Specialist, or Engineering Operations).
• Expert-level knowledge of Windchill (or similar PLM systems).
• Proficiency in Creo (highly advantageous) or other major CAD packages (SolidWorks, NX) is a must.
• Process Approach: Deep understanding of the ECO/ECR lifecycle, version control, and manufacturing hand-over protocols.
• Language: High-level English (written and verbal) for user documentation and international collaboration.
• Outstanding precision in handling metadata and the ability to multi-task in a fast-paced environment.
• Strong communication skills to bridge the gap between R&D, Procurement, and the Factory Floor. A dedicated team player with a high service orientation.

Nice to have:

• PCBA (electrical boards) design knowledge & experience. Familiar with IDF file exchange processes with Layout engineers.
• Electromechanical components (connectors) knowledge & experience.
• Background/knowledge in developing liquid cooled systems.

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What you’ll be doing:

• Lead the support of ECAD, MCAD and LE design teams.
• Define and implement software solution in EDA 's environment.
• Define and implement software solution in web environment.
• Working in cooperation with global teams in NVIDIA.

What we need to see:

• B.Sc. in Computer Engineering/Electrical Engineering or equivalent experience
• 12+ overall years of relevant experience
• Proven experience working in EDA platforms
• Proven experience in developing software within EDA - platform
• Proven experience developing complex flows and software capabilities
• Proven experience working with layout and design engineers
• Strong verbal and written communication skills in both English and Hebrew.

Ways to stand out from the crowd:

• Experience working with Board designers, Board layout engineers
• Familiarity with Allegro (Cadence) environment
• Familiarity with PTC - Creo tool and development environment.

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This key position includes leading the product design throughout all lifecycle stages from inception to Mass production, close interaction with HW, PMC (Product management & configuration), NPI, Thermal, Layout, Quality, and Supply chain teams.

NVIDIA Networking division offers market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability.

Responsibilities:

• Drive all the mechanical design aspects of optical transceivers, including PCB design, opto-mechanical chain and mechanical envelope.

• Independently lead product design from concept, through detailed design, and support it during Qualification, NPI and MP stages.

• Collaborate in research of ground-breaking technologies, materials, and processes with other groups to bring in creative ideas that solve ever-growing needs.

Requirements:

• B.Sc. in Mechanical Engineering or higher, (or equivalent experience).

• 5+ years of experience in electro-mechanical product design, including PCB/PCBA design.

• Self-motivated with a sharp learning curve and able to work independently and as a teammate.

• Excellent hands-on experience with 3D CAD. Autodesk Inventor or Creo is an advantage.

• Strong background in design of components for high-volume manufacturing technologies, such as: stamping, die casting, extrusion, and injection molding.

• High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and GD&T.

• Experience in fixtures and jigs design for assembly in high-volume manufacturing.

• Strong verbal and written communication skills in both English and Hebrew.

Nice to Have:

• Background in development of opto-mechanical products.

• Experience with thermo-mechanical design for electronic packaging: Hands-on experience developing cooling solutions and selecting Thermal Interface Materials (TIMs).

• Experience in IDF file exchange with Layout engineers

• Background with mechanical stress simulation tools such as ANSYS Mechanical.

• Experience in working with supply chains, contract manufacturers and leading resources such as consultants, component suppliers, contractors, and manufacturers.

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Your key responsibilities will include:

• Owning end-to-end product stabilization from first article to production release.
• Developing and maintaining hardware debug infrastructures, tools, and methodologies to support efficient root cause analysis.
• Monitoring, analyzing, and improving yield performance during NPI.
• Performing deep-dive failure analysis and root cause investigations to improve product robustness, quality, and throughput.
• Improving test stability, coverage, and repeatability while reducing false failures.
• Collaborating closely with Mechanical NPI engineers, Test Development teams, R&D, and manufacturing partners.
• Applying data analysis techniques to identify systemic issues, trends, and optimization opportunities.

To succeed in this role, you will need:

• A B.Sc. in Electrical Engineering.
• 4+ years of relevant experience in product engineering, failure analysis/debug, or HW/test design.
• Proven hands-on experience in HW debugging.
• Strong problem-solving abilities with a diligent approach.
• Outstanding interpersonal and communication skills in English.
• Ability to thrive in a collaborative and dynamic environment.

It would be beneficial if you have background with test design and HW lab equipment, experience with data/yield analysis, experience with JMP and/or other data analysis tools, experience working with a manufacturing environment, and basic programming knowledge (C, Perl, Python) in Linux environment.

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